Wafer Level Packaging with Wedge Seal Method
نویسندگان
چکیده
Wafer level packaging could reduce the cost of MEMS based sensors through simplified processing and inexpensive components. A novel vacuum tight seal referred to as the wedge seal method is proposed in this paper. The seal consists of a silicon wedge forced into a pliable material (typically a metal) that is attached to the component wafer. The wedge-seal addresses some of the requirements of micro-bolometer packaging in that it provides a vacuum tight seal at low temperatures with tolerance to surface finish and topography. The concept was evaluated with regards to manufacturability, material suitability and performance. A demonstrator model was manufactured with Complementary Metal–Oxide–Semiconductor (CMOS) compatible processing equipment and procedures. The wedge effectively penetrated the metal base and showed promising leak rates.
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